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The IEEE International 3D Systems Integration Conference - 9th - 11th October 2018

The IEEE International 3D Systems Integration Conference (3DIC) will take place on Tuesday 9th - Thursday 11th October 2018 in Tyndall National Institute, Cork

This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the IEEE CPMT sponsored 3D System Integration Conference held in 2003 & 2007 in Munich.

After the first combined conference in San Francisco in 2009, the 2nd IEEE International Conference on 3D System Integration was held in Munich in 2010, the 3rd conference in Osaka in 2012, the fourth conference in San Francisco in 2013, the fifth conference in Cork in 2014, the sixth conference in Sendai in 2015 and the seventh in San Francisco in 2016.

3DIC will cover all 3DIC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications.

For further information, Please contact Cian Ó Murchú at or on 021-2346426

 

120.000000 tickets available

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Product Description

3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following:

3D IC Technology. Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc.

3D IC Circuits Technology. 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc.

3D Applications. Imaging, memory, processors, communications, networking, wireless, biomedical etc.

3D Design Methodology. 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.